Excellon Installs HS-2L Intelli-Drill System at Bay Area Circuits


Reading time ( words)

Excellon announces the installation of an HS-2L Intelli-Drill System at Bay Area Circuits, Inc. of Fremont, California.

The Excellon HS-2L Intelli-Drill System provides capabilities such as post lamination tooling optimization for multi-layers, zone drilling and routing relative to surface targets and features such as surface sense depth control and reverse spindle rotation that set it apart from the competition. The fast and accurate axis positioning system uses linear motor technology making quick work of large panels up to 28 by 32 inches.

“We are excited with the addition of the HS-2L to Bay Area Circuits current drill process. Having the flexibility of another Intelli-Drill Vision System with the added two spindles will enhance the technology and turn-around time of complex PCB's,” said Stephen Garcia, president, Bay Area Circuits.

Mike Sparidaens, vice president of sales at Excellon, stated: "Having partnered with Bay Area Circuits since the 1970's Excellon looks forward to the implementation of the HS-2L Intelli-Drill System as well as being a part of Bay Area Circuit's high technology facility for years to come.”

About Bay Area Circuits, Inc.

Bay Area Circuits, Inc., has been serving the PCB needs of high-tech electronics manufacturers, contract assemblers, and design engineers for over 40 years. Located in the heart of Silicon Valley, Bay Area Circuits’ focus on high quality, quick-turn prototyping has enabled the company to become a premiere PCB supplier for discerning customers around the world. More information about Bay Area Circuits can be found by visiting the company's website.

About Excellon

Excellon, an employee-owned company, is recognized worldwide as a leader in installed PCB Drilling systems with products ranging from single and multiple station mechanical drilling machines to hybrid laser precision via formation and routing systems. Proudly designed and manufactured in the U.S.A. Click here for more information.

Share

Print


Suggested Items

Vertical Conductive Structures, Part 1: Rethinking Sequential Lamination

05/13/2019 | Joan Tourné, NextGIn Technology BV
Sequential lamination, as it is used today in high density interconnect (HDI) and derivative technologies, is constrained by the fact that one cannot plate a blind hole deeper than the diameter of the hole. A larger hole allows processes to plate deeper. In fact, this manufacturing constraint has made it a challenge even to reliably plate and process blind holes up to a 1:1 aspect ratio.

Staying Current on Flex Manufacturing is Smart Business

04/04/2019 | Barry Matties, I-Connect007
Brendan Hogan, managing director of smart electronics manufacturer MivaTek Global, discusses how to better design for flex, and ways designers can stay current on manufacturing technology that can impact their flex boards.

Automation on Full Display at Recent China Exhibitions

04/01/2019 | Barry Matties, I-Connect007
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.



Copyright © 2019 I-Connect007. All rights reserved.