EIPC SpeedNews: News from the European PCB Industry


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News from Germany

  • Atotech to Present Leading Fan-out Wafer-level Packaging Technology at SEMICON Taiwan 2017

News from Switzerland

  • Boy's and Men's Dream Come True: An Essemtec Pick and Place Machine Breathes Life into Model Railways!

News from the UK

  • John Pardini Appointed Global Account Manager for IMS Materials at Ventec International

News from the US

  • Ventec in Detroit
  • Thoughts as Hurricane Irma Approaches Florida

News from WECC Members

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 28

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Suggested Items

Ventec Shares Their Insights on the Laminate Market, Part II

09/13/2017 | Barry Matties, I-Connect007
The discussion on laminates and markets with Ventec’s Mark Goodwin continues as he talks about the importance of service, where Ventec is headed, and offers some advice on partnering with your supplier.

Ventec Shares Their Insights on the Laminate Market, Part I

09/12/2017 | Barry Matties, I-Connect007
I-Connect007’s Barry Matties sat down with the COO of Ventec USA/Europe, Mark Goodwin, to discuss the laminate market as a whole, the market segments behind that growth, and how Ventec has positioned itself in the thermal management space.

Review of the 2017 IPC Reliability Forum

07/18/2017 | Steve Williams
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.



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