Creative Materials Unveils One-Component B-Stageable Epoxy Adhesives


Reading time ( words)

Creative Materials, Inc., highlights our series of one-component B-stageable epoxy adhesives, developed for a wide variety of applications, including printed circuit board fabrication, advanced material composite structures, wafer-bonding, and heat sink applications. Versions of these products include our 125-22 and 125-22-F, silver-filled epoxy and epoxy film, designed with minimal flow and low-CTE properties for applications where ingress into cavities or vias is unacceptable.  Other products, 118-06 and 118-06-F, electrically conductive adhesives, are customized for ground plane bonding and die attach applications. Our 122-07 and 122-07-F are useful for electrical insulation and heat dissipation requirements, such as heat spreader bonding and chip/module attachment. Finally, our 124-07 and 124-07-F, are designed for hermetic sealing, lid attachment, and other non-conductive laminating adhesive solutions.

These products are suited to a wide variety of application processes including screen- printing, film transfer, syringe-dispensing, stencil printing, pad printing, and pin transfer. 

Products from Creative Materials are used in a variety of applications that provide cost-effective design solutions for demanding production requirements. Creative Materials is ISO 9001 and ISO 14001 certified. The company has extensive experience in the functional adhesive, ink and coating industry, combining technical expertise with nimble production capabilities, enabling a reduction in time-to-market for new product applications. We specialize in custom developed products. We ask our customers to challenge us to develop the right product for their application. 

Share

Print


Suggested Items

Materials for Automotive Applications: Thermal Management Issues

07/02/2020 | Pete Starkey, I-Connect007
For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.

3D Additive Electronics Manufacturing: Are We Nearing an Inflection Point?

05/28/2020 | Dan Feinberg, I-Connect007
Recently, Dan Feinberg was invited to attend a detailed and broadly informative webinar by nScrypt titled “The Strength of 3D-Printed Electronics," which covered the status and advances in the use of 3D printing for electronic device design and manufacture. nScrypt is an Orlando-based company founded in 2002 that focuses on 3D printing. Here’s what Dan learned from each of the speakers.



Copyright © 2020 I-Connect007. All rights reserved.