Abstracts Sought for IPC APEX EXPO 2018 in San Diego


Reading time ( words)

IPC — Association Connecting Electronics Industries invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:

  • 3D Printing in Electronics Manufacturing
  • Automation in Electronics Manufacturing
  • Adhesives
  • Advanced Technology
  • Area Array/Flip Chip/0201 Metric
  • Assembly and Rework Processes
  • BGA/CSP Packaging
  • Black Pad and Other Board Related Defect
  • Issues
  • BTC/QFN/LGA/MLF Components
  • Business & Supply Chain Issues
  • Cleaning
  • Conformal Coatings
  • Corrosion
  • Counterfeit Electronics
  • Design
  • Electromigration
  • Electronics Manufacturing Services
  • Embedded Passive & Active Devices
  • Environmental Compliance
  • Graphene in Electronics Manufacturing
  • Lean Six Sigma
  • LED Manufacturing
  • Failure Analysis
  • Flexible Circuitry
  • HDI Technologies
  • Head-on-Pillow
  • Board and Component Warpage
  • High Speed, High Frequency & Signal
  • Integrity
  • Industry 4.0
  • Lead-Free Fabrication, Assembly &
  • Reliability
  • Miniaturization
  • Nanotechnology
  • Optoelectronics
  • Packaging & Components
  • PCB Fabrication
  • PCB and Component Storage & Handling
  • Performance
  • Quality & Reliability
  • Photovoltaics
  • PoP (Package-on-Package)
  • Printed Electronics
  • Reshoring
  • RFID Circuitry
  • Robotics
  • Soldering
  • Surface Finishes
  • Test, Inspection & AOI
  • Tin Whiskers
  • 2.5-D/3-D Component Packaging
  • Underfills
  • Via Plugging & Other Protection
  • Wearables

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by October 27, 2017, click here.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Jasbir Bath, IPC technical conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.

About IPC

IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Share


Suggested Items

RTW…HKPCA & IPC Show 2017 Highlights With Canice Chung

12/08/2017 | Real Time with...HKPCA and IPC
Canice Chung, chairman of the HKPCA, speaks with Managing Editor Stephen Las Marias about the record-breaking show, held this week in Shenzhen, China.

HKPCA & IPC Show 2017: IPC Asia’s Philip Carmichael on the Changes in PCB Value Chain

12/07/2017 | Real Time with...HKPCA and IPC
During the 2017 International Printed Circuit & APEX South China Fair (HKPCA & IPC Show 2017) in Shenzhen, IPC Asia President Philip S. Carmichael speaks with I-Connect007 Managing Editor Stephen Las Marias about the move in the value chain that’s driving the electronics manufacturing industry forward.

HDI: Born in the USA and Making a Comeback

11/22/2017 | Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.



Copyright © 2017 I-Connect007. All rights reserved.