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Technic has released the TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask for flexible applications.
TechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive beta site testing of TechniFlex 423M has shown no cracking after multiple 180° bends, even when processing 12-micron polyimide substrate.
TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes. TechniFlex LCL 1000F/423M is available in two versions: U6 for direct imaging/manual exposure and U7 for either direct imaging/manual exposure or roll to roll coating operations.
"Today's cutting-edge flexible circuits require a strong yet flexible material that can withstand extremely high soldering temperatures and multiple bending cycles while still meeting very fine pitch requirements. Technic's new TechniFlex LCL 1000F/423M makes processing these advanced flexible PCBs possible," said Tom Horigome, global director of Imaging Products, Technic.
Technic is a Rhode Island based corporation with over 900 employees worldwide. For over 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.
Learn more here or contact us at (401) 781-6100.