EIPC to Hold Board of Directors Election and General Assembly Meeting at productronica 2017


Reading time ( words)

The EIPC General Assembly meeting will take place on November 16, during productronica 2017 in Munich, Germany. 

This year, EIPC also needs to elect a Board of Directors for the period 2018-2019. The outcome of the election will be presented at the General Assembly meeting and by email after the meeting. EIPC has always been very well served by an excellent team of directors, who give generously of their time and expertise to assist the Institute in its work and without whom we would be greatly impoverished. 

The voting procedure is as follows:

1. A maximum of 10 candidates can be voted for. Please note if more than 10 votes are marked on the election form, the form will not be valid.

2. Please give your vote by ticking the corresponding box.

3. If you wish to add additional candidates to the list please indicate it on the form using the space under 'New EIPC Board member. The maximum number of candidates has to remain 10.

4. In addition to the 10 candidates for the Board, please give your vote for the treasurer on the bottom of the election form.

5. Please return your voting form by email to kwestenberg@eipc.org.

Share


Suggested Items

Pluritec Wants to Remove Human Factor from Solder Mask

12/06/2017 | Pluritec
Solder mask remains a relatively hands-on task, which can result in human error. But equipment manufacturer Pluritec wants to change that. At PCB West, I spoke with Pluritec Vice President of Sales Lino Sousa about the company’s new spray technology that can turn solder mask application into what is essentially a push-button operation.

Leveraging Industry Shows to Create a Presence

11/07/2017 | Patty Goldman, I-Connect007
At the recent SMTA International show in Rosemont, Illinois, I had an opportunity to meet with Mark Osborn, president and owner of Colonial Circuits, based in Fredericksburg, Virginia. Colonial Circuits is a supplier of PCBs, mainly for the defense industry.

Process Engineering & Defect Prevention

10/06/2017 | Michael Carano, RBP Chemical Technology
Defects may “manifest” or be detected in or after a specific operation within the printed circuit board manufacturing process, but the underlying root cause may have occurred earlier (perhaps much earlier) in the process.



Copyright © 2017 I-Connect007. All rights reserved.