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The Taiwan Printed Circuit Association (TPCA) Show is now on its 18th year. This year's event will feature more than 1,400 booths and 400 global brands from over 12 countries. The TPCA Show 2017 will be held from October 25 to 27 at the Taipei Nangang Exhibition Hall in Taiwan.
With the iPhone 7 and 8 chip requirements, the MSAP (Modified Semi Additive Process) process application has become the focus of the PCB industry. Taiwan has the best PCB technology and processing products, and we believe that the MSAP process in HDI "any-layer" PCB will be among the key highlights of the show.
For more information about TPCA 2017, click here.
Dan Beaulieu, D.B. Management Group
I recently sat down with Artnet Pro Co-owner Meir Polack to discuss his company's move to represent Altix in North American, South America and parts of Asia. Artnet has traditionally sold pre-owned Orbotech and Camtek equipment, especially LDIs, but due to the increasing competitiveness of this high-end market they decided to seek out the best alternative in new DI equipment.
Stephen Las Marias, I-Connect007
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, Chris Ryder, director of product management for HDI at Electro Scientific Industries Inc. (ESI), discusses how laser-based processing is addressing the challenges in HDI development, and MSAP technology and its impact on the PCB industry.
Patty Goldman, I-Connect007
At productronica, MacDermid Enthone Electronics Solutions and Alpha Assembly Solutions had one large combined booth to promote the companies’ integration. Over a buttered pretzel (don’t knock it until you’ve tried it), we talked about the newly amalgamated company, something everyone in the company is quite enthusiastic about.