HDI Any-Layer PCBs Among Hot Topics at TPCA Show 2017


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The Taiwan Printed Circuit Association (TPCA) Show is now on its 18th year. This year's event will feature more than 1,400 booths and 400 global brands from over 12 countries. The TPCA Show 2017 will be held from October 25 to 27 at the Taipei Nangang Exhibition Hall in Taiwan.

With the iPhone 7 and 8 chip requirements, the MSAP (Modified Semi Additive Process) process application has become the focus of the PCB industry. Taiwan has the best PCB technology and processing products, and we believe that the MSAP process in HDI "any-layer" PCB will be among the key highlights of the show.

For more information about TPCA 2017, click here.

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