RTW SMTAI: What's New at MacDermid Enthone

Reading time ( words)

Jim Hartzell of MacDermid Enthone explains the responsibilities of his new position servicing the end-user  as part of a group that deals directly with OEMs. He also discusses MacDermid's steady growth and some of the hotter market segments, as well as a variety of new product offerings.

Watch the interview here.


Suggested Items

RTW IPC APEX EXPO: IPC—Industry Trends Moving Forward

03/20/2018 | Real Time with...IPC
Sharon Starr, director of market research for the IPC, discusses industry trends moving forward covering both EMS and PCB. She also mentions the upcoming studies IPC will be conducting in 2018.

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

RTW IPC APEX EXPO: Uyemura's Chemistry for ENIG, ENEPIG, and EPIG Apps

03/12/2018 | Real Time with...IPC
A unique deposition chemistry that combines immersion and reduction reactions to yield a gold finish with superior properties and controllability in ENIG, ENEPIG, and EPIG applications.

Copyright © 2018 I-Connect007. All rights reserved.