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John Piccirilli of NCAB Group discusses the trends in HDI and miniaturization he's seeing around the world. He also talks about other interesting technologies such as metal-backed PCBs and stretchable materials.
Watch the interview here.
I-Connect007 Editorial Team
Jan Pedersen of NCAB Group is deeply involved in IPC standards development surrounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive.
Andy Shaughnessy, PCB Design007
I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.
Andy Shaughnessy, I-Connect007
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.