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IPC—Association Connecting Electronics Industries has extended the deadline for submission of poster abstracts for the IPC APEX EXPO 2018 to December 1, 2017.
Poster presentations at IPC APEX EXPO, the industry's premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, are scheduled for February 28, 2018, and will be displayed throughout the event, which will be held in San Diego, California.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, in particular, automation in electronics manufacturing; assembly and rework processes; cleaning; flexible circuitry; PCB fabrication; reshoring; robotics; soldering; surface finishes; tin whiskers; wearables; and more.
For more information, click here.
Patty Goldman, I-Connect007
This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.
Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.