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IPC—Association Connecting Electronics Industries has extended the deadline for submission of poster abstracts for the IPC APEX EXPO 2018 to December 1, 2017.
Poster presentations at IPC APEX EXPO, the industry's premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, are scheduled for February 28, 2018, and will be displayed throughout the event, which will be held in San Diego, California.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, in particular, automation in electronics manufacturing; assembly and rework processes; cleaning; flexible circuitry; PCB fabrication; reshoring; robotics; soldering; surface finishes; tin whiskers; wearables; and more.
For more information, click here.
Dr. John Mitchell, IPC
President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.
IPC has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years.
Tara Dunn, OMNI PCB
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.