Reading time ( words)
- Institute of Circuit Technology Hayling Island Seminar 2017
- Am Labels presented with distribution award by anytron at LABELEXPO 2017
- NPL/SMART Process, Design & Reliability Seminar
- 3D Printing Shortens PCB Prototyping Cycle
News from productronica
- EIPC @ productronica 2017
- Viscom at productronica with outstanding solutions for 3D AOI and 3D AXI
04/12/2018 | Dan Feinberg, FeinLine Associates, Inc.
During IPC APEX EXPO, I met with CML USA General Manager Ivan Wong, who was a first-time attendee at the San Diego event. CML is a worldwide PCB sourcing solutions provider with offices around the globe, but the company just recently entered the U.S. market. I spoke with Ivan about CML’s mission and the U.S. office’s plans.
04/09/2018 | Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.
03/30/2018 | Real Time with...IPC
Sanjay Huprikar, IPC's VP of solutions, discusses the IPC solutions program, including transportation and workforce development initiatives.