EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- The WECC report of 2016 is now available for EIPC members

- EIPC & EIPC Members @ productronica 2017

News from Austria

- CEO & CFO Awards 2017: Monika Stoisser-Göhring Receives CFO Newcomer of the Year Award

News from Germany

- Smart Systems Integration: International Exhibition as a Presentation Platform of the Industry

News from productronica

- Cicor's DenciTec Technology Nominated for the productronica innovation award 2017

- Adeon Technologies BV will be proudly presenting our range of first class products

- Ventec to Showcase Thermal Management Solutions and Latest Laminate Technology at productronica

News from the UK

- Polar Instruments October News

- ESA Approval for Ventec Material in Amphenol Invotec Rigid & Flex-rigid Production

- Electra Polymers to Exhibit Soldermask for the Digital Era at productronica

- Institute of Circuit Technology, Evening Seminar, December 5, 2017

- Smart Group, BGA, QFN Fine Pitch Rework Experience Live, November 21, 2017, Henkel, UK

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 33

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Suggested Items

Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

Emma Hudson: From Tomboy to Tech Lead

06/21/2019 | Gen3
Interview between Emma Hudson and Gayle Paterson, founder of FLITE (Female Leaders in Tech, Everywhere).



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