TTM Technologies to Exhibit at 2017 HKPCA & IPC Show


Reading time ( words)

TTM Technologies, Inc. will be exhibiting at the annual International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show) at Booth 1L01. Themed "Global Wisdom Local Presence”, the Fair runs from December 6-8 and will be held at the Shenzhen Convention & Exhibition Center, China. TTM's Sales and Technical Experts are available for product and technical on-site discussions throughout the event.

“We always anticipate this annual PCB event in Asia as it has been a good platform for us to connect with local industry peers and customers,” said Kent Hardwick, TTM’s Senior Vice President of Sales. “As a technology leader, TTM is focused on helping our customers to keep up with the needs of the fast-changing electronics industry by providing them with the best solutions in the market.”

About International Printed Circuit & APEX South China Fair (HKPCA & IPC Show)

Since it was first staged in 2002, the Fair, jointly organized by the Hong Kong Printed Circuit Association (HKPCA), Association Connecting Electronics Industries (IPC), and the China Council for the Promotion of International Trade Guangzhou Sub-council (CCPIT-GZ), has grown year by year and evolved from a modest regional event into the PCB industry's premier international platform for networking, information exchange, education, and keeping up with market trends and the latest innovations.

About TTM Technologies, Inc. 

TTM Technologies, Inc. is a leading global printed circuit board (“PCB”) manufacturer, focusing on quick-turn and volume production of technologically advanced PCBs, flex and rigid flex PCBs, backplane assemblies and electro-mechanical solutions. TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market.

Share




Suggested Items

Don't Blink: The IPC APEX EXPO Time-lapse

01/31/2023 | Nolan Johnson, I-Connect007
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.

IPC APEX EXPO Wrap-up

01/30/2023 | Andy Shaughnessy, Design007 Magazine
IPC APEX EXPO 2023 is over, and I think it was successful show no matter how you slice it. There was barely a break in traffic on the show floor on Tuesday and Wednesday, and even on Thursday I saw people sprinting to close one more deal. Some committee meetings had nearly 200 participants; the meetings I sat in on were anything but boring.

NIST Resources for CHIPS Act Participants

01/27/2023 | Nolan Johnson, I-Connect007
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.