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AT&S Austria Technologie & Systemtechnik Aktiengesellschaft has completed the issue of a subordinated bond with an indefinite term and an early redemption option after five years (hybrid bond) very successfully. The issue, which was exclusively directed at institutional investors with a minimum subscription of EUR 100,000, was primarily placed with international investors with the issue amount totalling EUR 175 million. The targeted transaction volume thus significantly exceeded the first time a hybrid bond was issued by AT&S. The coupon was determined at 4.75% due to the great interest. After admission to trading, the hybrid bond will be traded on the Semi-official Market of the Vienna Stock Exchange.
“With the proceeds from this issue, we can strengthen our equity base and at the same time support the further strategic investment programme as a basis for long-term profitable growth,” said CEO Andreas Gerstenmayer. “We are pleased that we have also been able to broaden our investor base after the very positive investor road show due to the strong demand. This demonstrates the confidence in our development so far and our plans for the future.”
Pete Starkey and Patty Goldman, I-Connect007
The EIPC booth was a busy place during productronica, with several members and other organizations headquartered there, resulting in a constant stream of people stopping by to visit, get information and study the upcoming conference agendas. Overseeing the big, and even the little things, was Executive Director Kirsten Smit-Westenberg, who made sure important questions got answered, people stayed hydrated, and EIPC’s magnetic pins found homes on shirt collars.
Andy Shaughnessy, I-Connect007
Advanced Circuits is one of the largest PCB manufacturers in the United States. Now, the company is expanding the range of its services with the launch of its new Offshore Division. Recently, the company hired PCB veteran Greg Papandrew to lead the new division and help the company meet buyers’ demand for offshore PCB sourcing.
Patty Goldman, I-Connect007
I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.