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From the show floor at productronica 2017, we stopped by the DIS booth for a conversation with Tony Faraci. Here, he explains how DIS has tackled the challenges of handling and alignment of flex-rigid multilayer builds (especially cut-out pre-preg layers and packing pieces) and automated what was previously an operator-dependent manual process.
Watch The Interview Here:
Click here for more coverage from productronica 2017.
After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.
Dan Feinberg, Technology Editor, I-Connect007
We are about to begin the transition from the present cellular standard 4G LTE to the next generation, 5G. As in the past, most people will wonder, “What does 5G mean to me, and what is LTE anyway?” After all, if you can make your connection reliably and you can send and receive data at reasonable speeds, why should you really care?
Barry Matties, I-Connect007
June marks the start of summer, and with that, the EIPC’s annual summer conference. Highlighted by its thought-provoking presentations, social outings and factory tours, the conference continues to be valuable and productive for attendees. This year should prove no different, with EIPC set to celebrate its 50th anniversary. I spoke with EIPC Executive Director Kirsten Smit-Westenberg about what can be expected from the upcoming conference in Düsseldorf, Germany.