RTW…HKPCA & IPC Show 2017 Highlights With Canice Chung


Reading time ( words)

Canice Chung, chairman of the HKPCA, speaks with Managing Editor Stephen Las Marias about the record-breaking show, held this week in Shenzhen, China. He discusses how the show's turnout reflects the state of PCB manufacturing in China, as well as how this show has become a platform for collaboration to move the industry forward.

Watch The Interview Here

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/27/2023 | Nolan Johnson, I-Connect007
This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.

Integra: Redefining Die Prep in the U.S.

01/25/2023 | Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.

Ventec: Contextualizing the CHIPS Act

01/05/2023 | Nolan Johnson, I-Connect007
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.