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Copper-clad laminate (CCL) manufacturer ITEQ has announced plans to invest an additional $62.37 million to set up a new CCL plant in Jiangxi, China, seeking to expand its market share and meeting increasing demand from clients, according to a Digitimes report.
The new plant is slated for commercial production in June 2019 with a capacity of 600,000 sheets a month initially, and will ramp up to 1.2 million sheets depending on market demand.
I-Connect007 Editorial Team
During our walk-through of the GreenSource Fabrication facility with VP Alex Stepinski, he started the conversation on surface preparation and plating by saying, “We have Atotech horizontal production technology in place here. We’ve been running Atotech turnkey solutions for a while.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
E. Walch, DJ., C. Rietmann, Ph.D., and A. Angstenberger, Ph.D.
The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.