Printed Circuits Adds Engineering Manager Paul Peters and New Plating Capability in 2018


Reading time ( words)

Flex and rigid-flex circuit board manufacturer, Printed Circuits has started 2018 with a few enhancements to their wet processing department, starting with the appointment of Paul Peters to engineering manager of their plating and wet processing departments.

"Paul Peters brings a wealth of wet processing talent and experience to Printed Circuits. We are delighted to have his skill set added to our engineering talent," said Ken Tannehill, president and CEO. Paul has 39 years experience in wet processing in the PWB manufacturing industry and has worked with industry leaders MacDermid, OMG, and Electrochemicals, as well as Printed Circuits in previous positions.

"The timing of Paul's hire was ideal as we have just added electroplated platinum to our final finish capabilities," said Matt Tannehill, executive vice president. "Electroplated platinum is desirable as a final finish when folks are looking to use flexible circuits in implantable devices for medical applications," Matt continued. "It is ideal when electrodes or circuits will come into contact with human tissue or fluids, which is typical in implantable medical electronics applications that are growing in popularity."

About Printed Circuits

Printed Circuits is a US manufacturer of multilayer flex and rigid-flex printed circuit boards with over 40 years of experience building circuits typically used in high reliability applications such as medical, military and commercial electronics where customers place a premium on reliability, package density, and weight. For more information, click here.

Share

Print


Suggested Items

Quality by Design

06/14/2019 | Nolan Johnson, I-Connect007
The design team’s files and the accompanying documentation is the real-world implementation plan to turn the OEM’s concepts and marketing research into a viable, physical, competitive product. Unless manufacturing defies the build instructions from the designers, the product will only be as manufacturable as the design files themselves.

Orbotech Celebrates Success of Orbotech Diamond and Discusses Future Trends

05/31/2019 | Barry Matties, I-Connect007
At the recent CPCA Show in Shanghai, Orbotech celebrated having over 100 of their Orbotech Diamond™ direct imaging machines in the marketplace. Barry Matties caught up with Meny Gantz—VP of marketing for Orbotech’s PCB division—to talk about the drivers behind the success of Orbotech Diamond systems before turning the conversation toward the future and Industry 4.0.

FlexFactor Program Informs, Inspires, Attracts, and Recruits Talent

05/24/2019 | Nolan Johnson and Barry Matties, I-Connect007
Barry Matties and Nolan Johnson speak with Brynt Parmeter, Emily McGrath, Clarence Chi, and Mikayla Ridi about the NextFlex program FlexFactor. This initiative aims to help high school and college students see potential futures in the advanced manufacturing sector and combat common misperceptions young people might have about modern-day manufacturing.



Copyright © 2019 I-Connect007. All rights reserved.