PCBCart Exhibits at NEPCON Japan


Reading time ( words)

PCBCart exhibited at the NEPCON 47th Electronics R&D and Manufacturing Technology Expo in Tokyo, Japan.

During NEPCON Expo January 17-19, PCBCart displayed comprehensive classifications of the most advanced PCBs including Aluminum PCBs laminated with FR-4, PTFE high-frequency PCBs, ultra-thick PCBs, HDI PCBs with two steps, HDI flex-rigid PCBs, and multilayer mixed-laminate PCBs. Those products result from combinations of different top PCB fabrication technologies to meet increasingly higher demands of modern electronic products.

Apart from PCB fabrication, visitors also got access to PCB assembly and components sourcing capabilities of PCBCart. At PCBCart’s booth, customers learned about PCB assembly applications in electronic products serving industries of medical care, telecommunications, military, automotive, and consumer electronics. based on successful cases in the past over 10 years’ development. High-tech SMT assembly samples were also displayed with advanced assembly capabilities such as SMD 01005, fine-line BGA, QFN or WLCSP mounting, press fit, POP etc. Furthermore, standardized steps of components sourcing, inspection and storage principles were introduced to visitors as well during expo.

The NEPCON Expo showcased PCBCart’s partial market focus on PCB solutions, from PCB fabrication, PCB assembly to components sourcing. NEPCON Expo is Asia’s largest electronic show, which is held twice a year and will be held in September 2018 in Nagoya, Japan. Primary expo segments on display at NEPCON include electrotest, IC and sensor packaging technology, electronic components and materials, PWB, fine process technology, and LED and laser diode technology.

PCBCart is a worldwide electronic manufacturing service provider specializing in end-to-end electronic solutions. The primary services of PCBCart contain co-designing, DFM/DFA check, quick turn prototyping, SMT assembly, box build, quality control, NPI, and supply chain management. 

For more detailed information about PCBCart, please visit www.pcbcart.com.

Share


Suggested Items

A Sneak-Peek at IPC APEX EXPO 2018

01/24/2018 | Patty Goldman, I-Connect007
IPC President and CEO John Mitchell gave I-Connect007 a sneak-peek at the upcoming IPC APEX EXPO, happening in February in San Diego. Mitchell provides a description of this year’s keynote, as well as a few new additions and areas of emphasis. It looks like it will be another packed house, with plenty to see, do, and learn about.

CES 2018: Disruptive Technologies and Fun PC Stuff

01/24/2018 | Dan Feinberg, FeinLine Associates, Inc.
Two disruptive technologies that we have been covering for the last few years are 3D printing—especially as it pertains to PCB fab—and autonomous driving. 3D printing has been around for a few years, but it seems like 3D printers were introduced to CES very recently. This year there were almost 50 exhibitors showing their latest offerings. Most of them were in the LVCC in the north hall at the 3D Printing Marketplace.

Automation and Traceability Critical for High-Throughput Probe Testing

12/27/2017 | Barry Matties, I-Connect007
Peter Brandt, atg’s director of sales for Europe, India and Japan, joined Barry Matties at productronica to share his views on regional variations in electrical testing requirements, automation, traceability, and how to anticipate and satisfy the future demands of the market. Group general manager Dr. Jochen Kleinertz also comments on the need for close cooperation with customers to guide the R&D effort.



Copyright © 2018 I-Connect007. All rights reserved.