Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design
February 5, 2018 | Alex Stepinski, WHELEN ENGINEERINGEstimated reading time: 1 minute
Background
In 2014, Whelen Engineering Company, the OEM market leader in the emergency warning industry, developed the world’s first green smart PCB fab factory as a captive operation servicing internal demand. Due to the success of this venture, in 2016, a decision was made to explore building an upgraded factory which would serve the merchant market. This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.
Summary Approach
In our experience, a holistic DMADV approach to complex process design is not commonly used in the PCB industry. This approach requires a commitment to dedicated R&D re-sources, extensive travel by the technical team, a great deal of hands-on experience, as well as significant investment capital. Since very few PCB fabs perform R&D, we believe that there is a currently a very high ROI to this approach with low risk, since it is easy to design and secure strong competitive advantages when everyone else is just copying each other.
To read the full version of this article which appeared in the January 2018 issue of The PCB007 Magazine, click here.
Suggested Items
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.