Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design


Reading time ( words)

Background

In 2014, Whelen Engineering Company, the OEM market leader in the emergency warning industry, developed the world’s first green smart PCB fab factory as a captive operation servicing internal demand. Due to the success of this venture, in 2016, a decision was made to explore building an upgraded factory which would serve the merchant market. This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.

Summary Approach

In our experience, a holistic DMADV approach to complex process design is not commonly used in the PCB industry. This approach requires a commitment to dedicated R&D re-sources, extensive travel by the technical team, a great deal of hands-on experience, as well as significant investment capital. Since very few PCB fabs perform R&D, we believe that there is a currently a very high ROI to this approach with low risk, since it is easy to design and secure strong competitive advantages when everyone else is just copying each other.

To read the full version of this article which appeared in the January 2018 issue of The PCB007 Magazine, click here.

Share


Suggested Items

Book Recommendation: The Excellence Dividend—Meeting the Tech Tide with Work That Wows and Jobs That Last

07/16/2018 | Dan Beaulieu
If you wait for a Tom Peters book the way some people (myself included) wait for a new Stephen King novel, then you’re in luck because Tom finally has a new book and it’s a winner. This book covers a myriad of topics in pure Tom Peters fashion. Who but Peters could bring good old meat and potatoes common sense logic to this fast-moving new world order of social media and techno faux-communications?

EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 2

07/04/2018 | Pete Starkey, I-Connect007
Part 2 of I-Connect007 Technical Editor Pete Starkey's article on the recent EIPC 50th Anniversary Conference in Dusseldorf, Germany, continues with recap of technical presentations by Emma Hudson, Shannon Juan, Alex Ippich, and Russell Morgan. Read on.

PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G

06/27/2018 | Stig Källman, ERICSSON with Happy Holden, I-CONNECT007
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.



Copyright © 2018 I-Connect007. All rights reserved.