Reading time ( words)
Nancy Jaster is the manager of design process at IPC—and she has every right to be. As part of the technical staff team, she works directly with many IPC standards committees to support the industry, particularly those related to DFM and DFX guidelines, as well as those involved in data transfer. With 28 years’ experience in the industry—10 years in manufacturing and 18 years in design—she understands clearly what people need on the factory floor.
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.
To read the full version of this article which appeared in the January 2018 issue of The PCB007 Magazine, click here.
Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.
Patty Goldman, I-Connect007
As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?
Happy Holden, I-Connect007
I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”