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The printed circuit board (PCB) inspection equipment market in APAC is expected to grow at a CAGR of 14.72% during the period 2017-2021.
One trend in the market is emergence of Industry 4.0. The major focus of Industry 4.0 or the Fourth Industrial Revolution is to develop smart factories and IoT for industries. The adoption of Industry 4.0 has allowed for industrial advances in technology with the help of advanced computing, analytics, low-cost sensing, and the new levels of connectivity enabled through Internet.
One driver in the market is increasing use of X-ray systems for inspection due to advent of BGAs, chip-scale packages, and flip-chips. The use of BGAs and chip-scale packages mostly in consumer electronics has helped in increasing functionality and reducing the size of products. The growth of the telecom industry in recent years has reinvigorated the need for using X-ray inspection systems while manufacturing PCBs. Owing to the very small size of BGAs, chip-scale packages, and flip-chips, they are invisible to the naked eye. Hence, X-ray inspection systems are employed as they can detect joint quality underneath these packages without the need to destroy the PCB equipment for testing and inspection.