-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
2018 FLEXI Awards Innovation and Leadership in Flexible Hybrid Electronics
February 14, 2018 | SEMIEstimated reading time: 2 minutes
The 2018 FLEXI Awards today recognized groundbreaking accomplishments in the Flexible Hybrid Electronics (FHE) sector in 2017. Presented at the opening session of the 17th annual 2018FLEX Conference and Exhibition, in Monterey, California, the awards spotlighted the following leaders in the categories of R&D Achievements, Product Innovation and Commercialization, Education Leadership and Industry Leadership.
Product Innovation – E Ink, creator of Dazzle, the world’s largest electronic paper installation, won a FLEXI for product design and ingenuity, and potential market adoption and revenue generation. Made from electrophoretic display technology, the programmable art installation adorns one side of San Diego International Airport’s new rental car center.
R&D Achievement – The Wearable Device for Dynamic Assessment of Hydration team – consisting of GE Global Research, UES, The University of Arizona, University of Connecticut, University of Massachusetts Amherst, Dublin City University and AFRL – won a FLEXI for developing a paper-based biofluid patch that collects sweat for human hydration index monitoring. Award criteria included research approach, originality and commercial potential for expanding the bounds of flexible or printed electronics.
Technology Leadership In Education – James Turner, research scientist at Binghamton University, won a FLEXI for outstanding leadership and attention to mentoring students during the development of an FHE electrocardiography (ECG) patch. Turner led a group of students through the development which included a multi-disciplinary approach as well as coordination with industry and several academic institutions to correlate reliability data, simulations and optimize design features of the revolutionary patch.
Industry Leadership – David Morton, formerly with the Army Research Laboratory, won a FLEXI for his dedication to building awareness of advanced flexible hybrid electronics in the broader field of electronics. Award criteria include outstanding leadership in public forums and contributions to industry associations.
Technology Champion – Robert Reuss, former program manager in the Microsystems Technology Office at DARPA, won a FLEXI for his extraordinary dedication to growing the flexible electronics industry, early recognition of the impact of large area electronics and strong contributions to helping build the FLEX Conference.
FLEXIs have been the industry’s premier award for distinguished organizations and individuals since 2009. See full list of awardees. The FLEXI Awards are sponsored by FlexTech, a SEMI Strategic Association Partner, an organization dedicated to the success of the FHE sector. The 2018 FLEXI award ceremony was sponsored by SCREEN Holdings.
2018FLEX – February 12-15 in Monterey, California – spotlights FHE innovation drivers in smart medtech, smart transportation, smart manufacturing, smart data, Internet of Things (IoT) and consumer electronics.
About SEMI
SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (SEMI-MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.
Suggested Items
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
The Many Complexities of PFAS
03/26/2024 | Marcy LaRont, PCB007 MagazineIn its simplest definition, PFAS is a group of chemicals used to make fluoropolymer coatings and products that resist heat, oil, stains, grease, and water. Fluoropolymer coatings can be in a variety of products. Though this definition is not inaccurate, it can be misleading. Depending on who you ask, there are upward of 10,000 PFAS chemistries that can meet various definitions.