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News from the EIPC
- Review: EIPC Winter Conference Lyon
- Proceedings Conference Lyon Free of Charge by EIPC members
- New Date and Location of EIPC 50th Anniversary Conference: June 21–22, 2018, Geldern, Germany
News from Germany
- Smart Systems Integration 2018: Program Highlights for Visitors
Semiconductor Industry News
- Cryptocurrency Craze Boosts Demand for Memory Chips
News from Switzerland
- DYCONEX Opts for Automated Guided Vehicles
News from the UK
- SCS Partners with DTI to Sponsor UK Electronics Industry at International Events
- 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum
- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018
- Annual Foundation Course April 9–12; First day at Merlin PCB, Deeside, and then at Chester University
News from the USA
- Ventec to Showcase Thermal Management Solutions and Latest Laminate Technology at IPC APEX EXPO 2018
- Atotech to Present and Exhibit at the IPC APEX Expo 2018
News from WECC Members
Click here for the International Events Diary 2018
Click here to download the complete SpeedNews Issue 4
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Suggested Items
03/14/2018 |
Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
03/13/2018 |
Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
01/17/2018 |
Barry Matties, I-Connect007
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
