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RBP Chemical Technology will be holding a webcast on troubleshooting printed wiring board defects on Tuesday, February 20, 2018, at 11:00 am (CST).
Led by Mike Carano, RBP Vice President Technology and Business Development, this webcast series explores the most intricate factors of advanced problem solving of printed circuit board defects and how the interrelationship of both up and downstream processes contribute to scrap product.
Topics to be discussed include: panel versus pattern plating, imaging and developing defects, electroplating of copper, and proper process maintenance.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.
Stephen Las Marias, I-Connect007
In an interview with I-Connect007, Jimmy Fang, VP of business development at Sunshine Global PCB Group, speaks about the key demand drivers for the PCB industry, the challenges in the market, and the opportunities they are seeing.