RBP Webcast Tackles Printed Wiring Board Defect Troubleshooting

Reading time ( words)

RBP Chemical Technology will be holding a webcast on troubleshooting printed wiring board defects on Tuesday, February 20, 2018, at 11:00 am (CST).

Led by Mike Carano, RBP Vice President Technology and Business Development, this webcast series explores the most intricate factors of advanced problem solving of printed circuit board defects and how the interrelationship of both up and downstream processes contribute to scrap product.

Topics to be discussed include: panel versus pattern plating, imaging and developing defects, electroplating of copper, and proper process maintenance.


Suggested Items

Process Engineering & Defect Prevention

10/06/2017 | Michael Carano, RBP Chemical Technology
Defects may “manifest” or be detected in or after a specific operation within the printed circuit board manufacturing process, but the underlying root cause may have occurred earlier (perhaps much earlier) in the process.

A Process Engineer's Guide to Effectively Troubleshooting PWB Defects

05/12/2016 | Michael Carano, RBP Chemical Technology
The printed wiring board fabrication process is an intricate maze of interrelated steps, both chemical and mechanical. A thorough understanding of each of the process steps is critical in minimizing or eliminating non-conforming defects—the ones that cost the fabricator money and can lead to lost customers.

Copyright © 2018 I-Connect007. All rights reserved.