Reading time ( words)
As the IPC APEX EXPO events approach, iNEMI’s preparations for the Product Emulator Group (PEG) Workshop and Technology Working Group (TWG) Kick-Off on February 25 and 26 are finalizing. Attendees will hear updates from all the PEGs with respect to the latest industry analyses from Prismark, and then the TWG teams will formalize and share their plans to revise their reports.
iNEMI is also evangelizing for the roadmap effort during APEX EXPO week, spreading the word of this historical electronics roadmap and the value it brings to iNEMI members, roadmap participants and, of course, the electronics industry.
For more information and how to register for the PEG Workshop/TWG Kick-Off at IPC APEX EXPO, click here.
Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Patty Goldman, I-Connect007
I-Connect007's Patty Goldman has known DIVSYS’ Stan Bentley for many years, having met when the company was called Diversified Systems and they made circuit boards and finished products at their facility in Indianapolis. They saw each other at IMPACT recently, and of course had to have a chat.