EIPC SpeedNews: News from the European PCB Industry

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News from the EIPC

- Call for Papers for EIPC 50th Anniversary Conference: June 21–22, 2018, Dusseldorf, Germany

News from Germany

- Atotech to Present MultiPlate for Power IC at SEMICON China 2018

- Aegis Software to Host Exclusive Industry 4.0 Seminars on 'Paperless' Technology

- Atotech's MultiPlate for FOPLP, The Topic Everyone is Talking About at IMAPS Device Packaging Conference

News from the USA

- Polar Welcomes Dorine Gurney as President of Polar Instruments Inc.

News from WECC Members

Click here for the International Events Diary 2018 

Click here to download the complete SpeedNews Issue 6


Suggested Items

EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

02/12/2018 | Pete Starkey, I-Connect007
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

06/14/2017 | Pete Starkey, I-Connect007
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

HDP User Group 2017 European Meeting Highlights Technology Progress

06/07/2017 | Pete Starkey, I-Connect007
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.

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