EIPC SpeedNews: News from the European PCB Industry

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News from the EIPC

- Call for Papers for EIPC 50th Anniversary Conference: June 21–22, 2018, Dusseldorf, Germany

News from Germany

- Atotech to Present MultiPlate for Power IC at SEMICON China 2018

- Aegis Software to Host Exclusive Industry 4.0 Seminars on 'Paperless' Technology

- Atotech's MultiPlate for FOPLP, The Topic Everyone is Talking About at IMAPS Device Packaging Conference

News from the USA

- Polar Welcomes Dorine Gurney as President of Polar Instruments Inc.

News from WECC Members

Click here for the International Events Diary 2018 

Click here to download the complete SpeedNews Issue 6


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