RTW IPC APEX EXPO: Uyemura's Chemistry for ENIG, ENEPIG, and EPIG Apps


Reading time ( words)

Richard DePoto of Uyemura discusses a unique deposition chemistry that combines immersion and reduction reactions to yield a gold finish with superior properties and controllability in ENIG, ENEPIG, and EPIG applications.

To watch the interview, click here.

Share




Suggested Items

Engineering RF Dielectric Material to Enable 5G/6G Antenna Devices

04/11/2022 | Chudy Roosevelt Nwachukwu, ITEQ Corporation
Accurate characterization of frequency-dependent inhomogeneous dielectric material properties is key to the optimal design of high performance and cost-effective PCB antennas. These antennas will be required to enable the plethora of devices forecasted for 5G/6G communication. Therefore IT-88GMW, an advanced resin system reinforced with tightly woven thin glass fibers has been formulated to improve the Q-factor of interconnects and passive components fabricated on PCB laminates.

Measuring Multiple Lamination Reliability for Low-loss Materials

04/04/2022 | John Strubbe, Taiwan Union Technology Corporation
Taiwan Union Technology Corporation (TUC) provides copper-clad laminates and dielectric resin composites used to manufacture printed circuit boards. The enthalpy of these resin composites meets and exceeds customers’ objectives and shows the deterioration of the resin’s physical properties as a result of multiple lamination cycles (up to 10X). This article describes how TUC evaluates the possible change in resin structure due to multi-thermal laminations.

PCB Material Toolbox for Today’s 3G and 4G Networks and Future High-Speed Needs in 5G

06/27/2018 | Stig Källman, ERICSSON with Happy Holden, I-CONNECT007
The material toolbox idea first came up when I saw the IPC appendix list for standard 1-ply stack-ups. The idea is to make a very simple bill of materials, specifications and notes, and possibly use the same prepreg/resin in the laminate and in the core.



Copyright © 2022 I-Connect007. All rights reserved.