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Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX EXPO 2024

03/26/2024 | Ventec International Group
Ventec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX EXPO 2024, April 9-11 on booth # 4309.

Indium Corporation Celebrates 90 Years of Materials Science Innovation

03/13/2024 | Indium Corporation
Indium Corporation will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.

Indium Corporation Technical Manager to Present at SMTA Taiwan Tech Forum

03/12/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou’s presentation will highlight the growing demand for high reliability and low-temperature solder solutions brought on by the rapidly developing electric vehicle (EV) and artificial intelligence (AI) industries.

BTU to Unveil Aurora in the US at the 2024 IPC APEX EXPO

03/12/2024 | BTU International, Inc.
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO.

Indium Corporation Experts to Present at SEMI THERM

03/07/2024 | Indium Corporation
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.
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