IPC Volunteers Honored for their Contributions to Industry at IPC APEX EXPO 2018


Reading time ( words)

IPC – Association Connecting Electronics Industries presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO 2018 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

For their leadership of the D-32 subcommittee in the development of IPC-TM-650 2.6.27A, Jerry Magera, Motorola Solutions; Jim Monarchio, TTM Technologies, Inc.; and Joey Rios, Massachusetts Institute of Technology earned a Committee Leadership award. For their contributions to IPC-TM-650 2.6.27A, Lance Auer, Conductor Analysis Technologies, Inc.; Tim Estes, Conductor Analysis Technologies, Inc.; Chris Mahanna, Robisan Laboratory, Inc.; Nick Meeker, Conductor Analysis Technologies, Inc.; Wesley Moreau, Extreme Engineering Solutions, Inc.; Jeff Sonnenberg, Extreme Engineering Solutions, Inc.; and Jennet Volden, Rockwell Collins, earned a Distinguished Committee Service Award.

For their leadership of the 2-18K committee that developed IPC-1754, Materials and Substances Declaration for the Aerospace, Defense, Heavy Equipment and Other Industries, Walter Jager, ECD Compliance; Rick Shanks, Pratt & Whitney; and Jean-Pierre Theret, Dassault Systemes, earned a Committee Leadership award. For their significant contributions to IPC-1754, Dr. N Nagaraj, Papros Inc., and Raj Takhar, Assent Compliance Inc., earned a special recognition award. For their contributions to IPC-1754, Douglas Aylward, Raytheon; Brenda Baney, B Cubed Consulting; Dave Billings, Rolls-Royce PLC; James Calder, Assent Compliance Inc.; Cindee Cognetta, Raytheon; Francois Ducamp, Airbus SAS; Renato da Nova Favarin, Embraer S.A.; Linda Fetterman, Boeing Company; Marelle Fogel, DXC; Richard Forselius, Sikorsky Aircraft; Brenda Fukai-Allison, Boeing Company; Andy Gbur, Tetra Tech; Valerie Kuntz, Assent Compliance Inc; Chuck LePard, DXC; Manish Patel, Cummins Inc.; Mussie Pietros, Gelcore; Margaret Proul, Lockheed Martin; Timothy Sheehan, Raytheon Company; Eric Straw, Rockwell Collins; Gail Sutherland, Tetra Tech; John Wagner, Association of Equipment Manufacturers; Michael Wurzman, RSJ Technical Consulting, and Paul Ylioja, Granta Design, earned a Distinguished Committee Service Award.

For their leadership of the 3-11 Subcommittee that developed IPC- 4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards, Tony Senese, Panasonic Industrial Devices Sales Company of America (PIDSA); and Doug Sober, Essex Technologies Group Inc., earned a Committee Leadership award. For their contributions to the revision of IPC-4101E, Steven Ethridge, Dell Inc.; Terry Fischer, Hitachi Chemical Company America, Ltd.; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Pierre-Emmanuel Goutorbe, Airbus Defence and Space; Vicka Hammill, Honeywell Inc. Air Transport Systems; Stan Hertzel, European Space Agency; Philip Henault, Raytheon Company; Doug Leys, Neltec, Inc.; Renee Michalkiewicz, NTS – Baltimore; Jim Monarchio, TTM Technologies, Inc.; Karl Sauter, Oracle America, Inc.; Bhanu Sood, NASA Goddard Space Flight Center; Chris Totten, Isola Group SARL; and Dan Welch, Rogers Corporation, earned a Distinguished Committee Service Award.

For their leadership of the 5-23a Printed Circuit Board Solderability Specifications Task Group that developed J-STD-003C, WAM 1& 2, Solderability Tests for Printed Boards, Gerard O’Brien, Solderability Testing and Solutions, Inc.; and Michah Pledger, Vivant, Inc., earned a Committee Leadership award. For their contributions, Martin Bayes, TE Connectivity; Scott Bowles, L-3 Fuzing and Ordnance Systems; Lenora Clark, MacDermid Enthone Electronics Solutions; Dave Hillman, Rockwell Collins; Henry Rekers, Schneider Electric; and Joey Rios, Massachusetts Institute of Technology, earned a Distinguished Committee Service Award.

For their leadership of the IPC Component and Wire Solderability Specification Task Group that developed EIA/IPC/JEDEC-J-STD-002E, Dennis Fritz, MacDermid Enthone Electronics Solutions; Dave Hillman, Rockwell Collins; Ife Hsu, Intel Corporation; and Douglas Romm, Texas Instruments Inc., earned a Committee Leadership Award. For their contributions to this standard, Beverley Christian, HDP User Group; James Daggett, Raytheon Company; Todd MacFadden, Bose Corporation; Graham Naisbitt, Gen3 Systems Limited; Bradley Smith, Allegro Microsystems Inc.; Donald Tyler, Corfin Industries LLC; and Vijay Kumar, Lockheed Martin Missiles and Fire Control, earned a Distinguished Committee Service Award.

For their leadership of 5-22a, the J-STD-001 Task Group that developed J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies, Dan Foster, Missile Defense Agency; and Kathy Johnston, Raytheon Missile Systems, earned a committee leadership award. For their leadership of 7-31b, the IPC-A-610 Task Group that developed IPC-A-610G, Acceptability of Electronic Assemblies, Robert Fornefeld, L-3 Technologies; Constantino Gonzalez, ACME Training & Consulting; and Mary Muller, Crane Aerospace & Electronics, earned a committee leadership award. For significant contributions in the development of IPC-A-610G, and J-STD-001G, Robert Cooke, NASA Johnson Space Center; Dan Foster, Missile Defense Agency; Dave Hillman, Rockwell Collins; Kathy Johnston, Raytheon Missile Systems; Joseph Kane, BAE Systems; Leo Lambert, EPTAC Corporation; Mary Muller, Crane Aerospace & Electronics; Doug Pauls, Rockwell Collins; Debbie Wade, Advanced Rework Technology-A.R.T.; and Udo Welzel, Robert Bosch GmbH, earned a special recognition award. For their contributions and efforts to either or both IPC-A-610G or J-STD-001G, Erik Bjerke, BAE Systems; James Blanche, NASA Marshall Space Flight Center; Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.; William Cardinal, UTC Aerospace Systems; Robert Cooke, NASA Johnson Space Center; James Daggett, Raytheon Company; Ross Dillman, ACI Technologies, Inc.; Symon Franklin, Custom Interconnect Ltd.; Dave Hillman, Rockwell Collins;  Ife Hsu, Intel Corporation; Milea Kammer, Honeywell Aerospace; Joseph Kane, BAE Systems; Patrick Kane, Raytheon System Technology; Gary Latta, SAIC; Garry McGuire, NASA Marshall Space Flight Center; John Mastorides, Honeywell Aerospace; William D. May, NSWC Crane; Scott Meyer, UTC Aerospace Systems; David Mitchell, Lockheed Martin Mission Systems & Training; Gregg Owens, Jet Propulsion Laboratory; Agnes Ozarowski, BAE Systems; Helena Pasquito, EPTAC Corporation; Irene Romero, Delta Group Electronics Inc.; Richard Rumas, Honeywell Canada; James Saunders, Raytheon Company; Patricia Scott, STI Electronics, Inc.; Jose Servin Olivares, Continental Temic SA de CV; Zenaida Valianu, Celestica; Jon Vermillion, Ball Aerospace & Technologies Corp.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a distinguished committee service award.

For their leadership of the 5-22BT Task Group that developed the J-STD-001 Training and Certification Course, Dan Foster, Missile Defense Agency; and Zenaida Valianu, Celestica, earned a committee leadership award. For their significant contribution to the development of the J-STD-001 Training and Certification course, Carol Stirling, EPTAC Corporation, earned a special recognition award. For their contributions, Kevin Boblits, Circuit Technology Inc.; Charles Gamble, NASA Marshall Space Flight Center; Leo Lambert, EPTAC Corporation; and Agnieszka Ozarowski, BAE Systems, earned a distinguished committee service award.

For their leadership in the development of the J-STD-001 Training and Certification course for the 5-22B TEU task group, Symon Franklin, Custom Interconnect Ltd.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a committee leadership award. For his contributions, Eric Hinsley, The Electronics Group Ltd., earned a distinguished committee service award.

For their leadership of the 7-31BT Task Group that developed the IPC-A-610G Training and Certification Course, Mary Muller, Crane Aerospace & Electronics; and Helena Pasquito, EPTAC Corporation, earned a committee leadership award. For his significant contribution to the training course, William Graver, NTS – Baltimore, earned a special recognition award. For her contributions, Elizabeth Allison, NTS – Baltimore, earned a distinguished committee service award.

For their contribution to the 5-22BTEU Task Group that developed the IPC-A-610G Training and Certification Course, Symon Franklin, Custom Interconnect Ltd.; and Debbie Wade, Advanced Rework Technology-A.R.T., earned a committee leadership award. For his contributions, Rob Mullane, earned a distinguished committee service award.

For his leadership of the Process Consumable Statistical Committee, Michael Carano, RBP Chemical Technology, Inc., earned a committee leadership award.

For his excellent leadership of the PERM Council in the development of IPC/PERM 2901, Anthony Rafanelli, Raytheon Missile Systems, earned a committee leadership award. For their contributions to IPC/PERM 2901, Martin Anselm, Rochester Institute of Technology; Jelena Bradic, Honeywell Aerospace; Richard Coyle, Nokia; Reza Ghaffarian, Jet Propulsion Laboratory; Ben Gumpert, Lockheed Martin Missiles and Fire Control; David Hillman, Rockwell Collins; Milea Kammer, Honeywell Aerospace; Jeff Kennedy, Celestica; Frank-Peter Kriesch, Diehl Aerospace GmbH; Gary Latta, SAIC; Dale Lee, Plexus Corporation; David Locker, U.S. Army Aviation & Missile Command; Stephen Meschter, BAE Systems; Steven Middleton, Foresite, Inc.; Mick Miller, NSWC – Crane; Andre Oliveira, Embraer; David Pinsky, Raytheon Missile Systems; Jeff Rowe, JR Consulting; Mark Van Solkema, GE Aviation; and Linda Woody, LWC Consulting, earned a distinguished committee service award.

Share


Suggested Items

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

08/28/2018 | Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.

Thermal Capabilities of Solder Masks: How High Can We Go?

08/24/2018 | Sven Kramer, Lackwerke Peters
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.

Circuit Automation on the Ever-Evolving World of Solder Mask

08/23/2018 | I-Connect007 Editorial Team
In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.



Copyright © 2018 I-Connect007. All rights reserved.