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Electronics designers and the production side have always locked heads: the designers want to make everything smaller and smaller and more cost effective; unfortunately, this is sometimes counterproductive to both the PCB manufacturers and assemblers. This always results in a compromise on both sides, often affecting the quality and electrical stability of the boards.
One such issue that often arises is finding a suitable solution to utilizing the pad as a through-hole connector without causing production and quality issues with solder wicking away through the via and causing insufficient, unstable, or even unsoldered joints.
To address this issue, Eurocircuits is now offering a via filling and conductive capping service to enable designers to increase board density without reducing reliability.
For more information, click here.