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Electronics designers and the production side have always locked heads: the designers want to make everything smaller and smaller and more cost effective; unfortunately, this is sometimes counterproductive to both the PCB manufacturers and assemblers. This always results in a compromise on both sides, often affecting the quality and electrical stability of the boards.
One such issue that often arises is finding a suitable solution to utilizing the pad as a through-hole connector without causing production and quality issues with solder wicking away through the via and causing insufficient, unstable, or even unsoldered joints.
To address this issue, Eurocircuits is now offering a via filling and conductive capping service to enable designers to increase board density without reducing reliability.
For more information, click here.
Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Sven Kramer, Lackwerke Peters
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.
I-Connect007 Editorial Team
In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.