Eurocircuits Expands Service Offerings


Reading time ( words)

Electronics designers and the production side have always locked heads: the designers want to make everything smaller and smaller and more cost effective; unfortunately, this is sometimes counterproductive to both the PCB manufacturers and assemblers. This always results in a compromise on both sides, often affecting the quality and electrical stability of the boards.

One such issue that often arises is finding a suitable solution to utilizing the pad as a through-hole connector without causing production and quality issues with solder wicking away through the via and causing insufficient, unstable, or even unsoldered joints.

To address this issue, Eurocircuits is now offering a via filling and conductive capping service to enable designers to increase board density without reducing reliability.

For more information, click here.

Share


Suggested Items

Elga Europe Reality and Ultra-High-Resolution Photoresist

04/24/2018 | Patty Goldman, I-Connect007
While walking around the PCB hall at productronica, I was approached by my good friend Gene Weiner. Gene emphatically directed me to the Elga booth to find out about their new extra-thick dry film that can image extremely fine features with a perfectly perpendicular sidewall. Elga Europe CEO Giorgio Favini filled me in on the details.

Setting the Record Straight: CEO Asher Levy on the Future of Orbotech

04/23/2018 | Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.

IPC 6012-DA Revisions: The Approach to Cleanliness, Thickness, Inspection, and Wicking

04/13/2018 | Jan Pedersen, ELMATICA
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.



Copyright © 2018 I-Connect007. All rights reserved.