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VP Shane Stewart describes some recently developed coating technology for small drills that helps improve debris removal and aspect ratio drilling capability.
To watch this interview, click here.
Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.
Alun Morgan, Ventec International Group
The electronics industry as we know it today can trace its birth to the creation of the first integrated circuit in 1958, although conception occurred 10 years earlier with the invention of the transistor. That first IC contained a single transistor and four passive components. To say things have come a long way since then is a huge understatement.
Happy Holden, I-Connect007
For North America, there is a growing need for more ultra-high density HDI capability. Some of the reasons for the slower adoption of SAP/HDI fabrication may rest with two obstacles: Subtractive processes have difficulty as they approach 50-micron traces and spaces (0.002”), and it is not clear what the total system acquisition costs will be for ultra-HDI.