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Tony Mattingly, senior product manager at Rogers Corporation, discusses the company's new substrates for high-frequency/high-temperature applications.
To watch the interview, click here.
I-Connect007 Editorial Team
John Andresakis, senior marketing technologist in the Interconnect Solutions (ICS) Group of DuPont, and Jonathan Weldon, RF applications engineer also in ICS at DuPont, spoke with the I-Connect007 editorial team about trends the company is seeing, what challenges their customers are facing with materials today, and future opportunities with new technologies, including 5G, electric cars, IoT, and more.
Nolan Johnson, I-Connect007
Nolan Johnson and Tony Senese—manager, business development group, Panasonic EMBD—discuss the evolution of the materials marketplace over the years from a time when the market aligned for the rise of Panasonic’s MEGTRON 6 to the ever-changing materials industry of today. With the ramp-up to 5G and everyone pushing product development, Tony describes a chaotic materials market flooded with new companies and materials.
M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.