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More powerful LED applications demand an increased focus on thermal management. More powerful LEDs produce more heat and temperature rise has an impact on the short-term function of a LED part such as color shift and reduced light output.
The long-term effects shouldn’t be neglected either. Higher operating temperatures can result in a reduced life time.
To reduce the operating temperature, and thus the impact of the temperature on LED applications or power converters, Eurocircuits has upgraded its IMS material. The formerly used Polytherm TC-Lam 1.3 is now succeeded by Polytherm TC-Lam 2.0.
The main difference is the dielectric. This thermally conductive layer has better properties, such as thermal conductivity of 2.0 W/mK (upgrade from 1.3 to 2.0), and thermal resistance: 0.50 K/W (lowering from 0.77 to 0.5).
The thick aluminum (alloy 5052) layer remains the same and is responsible for the heat dissipation. The copper foil on the opposite side is still 35 microns thick. This copper layer forms the base for the circuit. Other service parameters remain unchanged.
04/24/2018 | Patty Goldman, I-Connect007
While walking around the PCB hall at productronica, I was approached by my good friend Gene Weiner. Gene emphatically directed me to the Elga booth to find out about their new extra-thick dry film that can image extremely fine features with a perfectly perpendicular sidewall. Elga Europe CEO Giorgio Favini filled me in on the details.
04/10/2018 | Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.
04/09/2018 | Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.