Aspocomp Acquires Technopolis Facility in Finland

Reading time ( words)

Aspocomp Group Plc has acquired from Technopolis Plc the production facility, located in the Linnanmaa district, at Tutkijantie 11-13 in Oulu, Finland. Ownership and control of the buildings will be transferred from Technopolis to Aspocomp on April 1, 2018. As part of the transaction, Aspocomp will gain land lease rights to the plot. The transaction is estimated to have a positive impact on the company's operating result and cash flow starting from the second quarter.

The company's full-year guidance remains unchanged. In 2018, net sales are expected to grow approximately 10 percent and the operating result to be better than in 2017. In 2017, net sales amounted to EUR 23.0 million and the operating result to EUR 0.8 million.

About Aspocomp

A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee cost-effectiveness and reliable deliveries.

Aspocomp’s customers are companies that design and manufacture telecommunication systems and equipment, automotive and industrial electronics, and systems for testing semiconductor components for security technology. The company has customers around the world and most of its net sales are generated by exports.

Aspocomp is headquartered in Espoo and its plant is in Oulu, one of Finland’s major technology hubs.

For more information, click here.


Suggested Items

From Math to Marketing: Orbotech CMO’s Worldview of the Industry

04/09/2018 | Barry Matties, I-Connect007
Barry Matties met with Orbotech’s corporate VP of Business Development and CMO, Lior Maayan, in Shenzhen and spoke about the next-generation processes currently challenging Orbotech's R&D team. Most notable among them are additive technologies like the automated optical shaping solution, and the growth of MSAP, flex, and HDI.

Equipment/Process Selection: Case Study of a DMADV Approach to PCB FAB Process Design

02/05/2018 | Alex Stepinski, WHELEN ENGINEERING
This article outlines the approach we took to designing this new phase of our commercial existence, which has now been spun off as a separate business unit known as Greensource Fabrication. This new business unit is expected to go live in 2018.

HDI: Today, Tomorrow and the Future

12/05/2017 | I-Connect007
For the November issue of The PCB Magazine, our editorial team interviewed some of the top HDI experts in the PCB supply chain. Joining us on the conference call were Steve Bird, PCB/flex technology manager at Finisar, and Tony Torres of APCT.

Copyright © 2018 I-Connect007. All rights reserved.