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It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix. Brian passed away on March 11, 2018.
Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task groups dedicated to high speed/high frequency design, serving as chair of the IPC D-24a Characteristic Impedance Test Methods Task Group and vice chair of the IPC D-24d High Frequency Signal Loss Task Group. In doing so, Brian led numerous efforts to develop and revise IPC-TM-650 Test Methods for usage by printed board fabricators in these technology areas.
His energy, enthusiasm and valuable contributions to the industry will be missed by many. On behalf of the electronics industry, IPC offers its condolences to Brian’s wife, Christine, their sons, Daniel and Ben, and Brian’s parents. A detailed obituary was posted by Christine here.
On the last morning of IPC APEX EXPO 2018, we met with Nancy Jaster, IPC design programs manager and one of the driving forces behind IPC’s STEM Outreach program for high school students. We spoke about the students who were arriving on site at IPC APEX EXPO, and what the industry, and IPC, hoped to achieve with this valuable program.
Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
Patty Goldman, I-Connect007
We’ve all heard the cliché: What goes around, comes around. I’ve always felt that was especially true in our industry, with the frequent job changes people make—much accelerated in recent years but always a factor, since I can remember.