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It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix. Brian passed away on March 11, 2018.
Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task groups dedicated to high speed/high frequency design, serving as chair of the IPC D-24a Characteristic Impedance Test Methods Task Group and vice chair of the IPC D-24d High Frequency Signal Loss Task Group. In doing so, Brian led numerous efforts to develop and revise IPC-TM-650 Test Methods for usage by printed board fabricators in these technology areas.
His energy, enthusiasm and valuable contributions to the industry will be missed by many. On behalf of the electronics industry, IPC offers its condolences to Brian’s wife, Christine, their sons, Daniel and Ben, and Brian’s parents. A detailed obituary was posted by Christine here.
Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Patty Goldman, I-Connect007
I-Connect007's Patty Goldman has known DIVSYS’ Stan Bentley for many years, having met when the company was called Diversified Systems and they made circuit boards and finished products at their facility in Indianapolis. They saw each other at IMPACT recently, and of course had to have a chat.