FLEX Taiwan June Debut Showcases Flexible Electronics


Reading time ( words)

FLEX Taiwan debuts June 7 at the Taipei International Convention Center (TICC), showcasing the latest flexible hybrid electronics (FHE) technology, innovations and industry insights. Organized by FlexTech, a SEMI Strategic Association Partner, the one-day technical conference provides a powerful platform for connecting with customers, suppliers, future partners and academia to drive collaboration and uncover new opportunities. 

2018 Flex Taiwan LogoProjected to reach US$73.43 billion by 2027, the global flexible electronics market is expected to be a major growth driver for the microelectronics industry. The lightweight, ultra-thin and foldable features of flexible electronics are inspiring new applications beyond the capabilities of traditional silicon- or glass-based substrates.

Featuring 14 keynote speeches, FLEX Taiwan 2018 brings together leaders across the semiconductor, flat panel display, sensor and other industries. Industry-leading companies including Robert Bosch, Brewer Science, E Ink, Jabil Circuit and top international research organizations will gather to share insights on market trends, innovative materials, advanced manufacturing technology and FHE application opportunities.

“Taiwan is a leader in manufacturing technology and has a complete supply chain for displays,” said SEMI Taiwan President Terry Tsao. “With these strengths, Taiwan is well-positioned to accelerate the commercialization of FHE products.”

For the past 17 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China.

To register for FLEX Taiwan 2018, click here. Take advantage of the early bird registration discount through May 25, 2018.

About SEMI

SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, click here.

Share


Suggested Items

Future Automotive Requirements for PCBs

05/21/2018 | Dr. Christian Klein
In the automotive electronics industry, a huge change in functional and environmental requirements will be visible during the next few years. This is driven by three major trends: connected mobility, automated mobility, and the increasing electrified mobility.

Automotive, the Electronics Industry’s New Drive

05/16/2018 | Patty Goldman, I-Connect007
The automobile industry is becoming a combination of most of the traditional electronics segments: It’s a consumer product with a computer, communications center, and a few medical monitoring-type tendencies (measuring your alertness, heart rate, etc.), all rolled (no pun intended) into one incredible machine that is influencing our industry as none other.

Schmid Looks to the Future for Industry 4.0 and More

04/26/2018 | Patty Goldman, I-Connect007
I met with Rüdiger Lange, CSO at Schmid Group, in their spacious, comfortable booth at productronica. We discussed the current capital equipment market and Schmid’s business direction for the future while watching some of their new technology in action.



Copyright © 2018 I-Connect007. All rights reserved.