Future Automotive Requirements for PCBs


Reading time ( words)

Introduction

The Bosch Group is a leading global supplier of technology and services. They also develop and manufacture automotive electronic components and systems. In addition to the standard product testing, the PCB Technology team always qualifies new PCB technologies before going into product testing. In the past, we found failures in PCBs during these qualifications along with the potential for design and stackup improvements together with the supply chain. These findings were incorporated into our specification and brought to international standards committees.

In the automotive electronics industry, a huge change in functional and environmental requirements will be visible during the next few years. This is driven by three major trends: connected mobility, automated mobility, and the increasing electrified mobility.

All three trends will increase the added value of electronics in the car. For PCBs, the applied technologies will change to deal with high currents of several 100 A and information processing in a range of several GHz. From a functional performance standpoint, this is far beyond the current PCBs in the cars and new concepts are needed. Figures 1 through 4 illustrate the three major trends of connected mobility, automated mobility, and powertrain systems and electrified mobility.

Fig1.jpg

Figure 1: The three major trends for automotive electronics. (Source: Bosch).

To read the full version of this article which appeared in the April 2018 issue of PCB007 Magazine, click here.

 

Share


Suggested Items

RTW HKPCA & IPC Show 2017: IPC Asia’s Philip Carmichael on the Changes in PCB Value Chain

12/07/2017 | Real Time with...HKPCA and IPC
During the 2017 International Printed Circuit & APEX South China Fair (HKPCA & IPC Show 2017) in Shenzhen, IPC Asia President Philip S. Carmichael speaks with I-Connect007 Managing Editor Stephen Las Marias about the move in the value chain that’s driving the electronics manufacturing industry forward.

HDI’s Beneficial Influence on High-Frequency Signal Integrity

10/17/2017 | Happy Holden, I-Connect007
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

RTW SMTAI: NCAB's Perspectives on HDI and Miniaturization

11/01/2017 | Real Time with...SMTAI
John Piccirilli of NCAB Group discusses the trends in HDI and miniaturization he's seeing around the world. He also talks about other interesting technologies such as metal-backed PCBs and stretchable materials.



Copyright © 2018 I-Connect007. All rights reserved.