Panasonic Develops Ultra-Low-Loss PCB Material for Packages and Modules


Reading time ( words)

Panasonic Corporation has developed an ultra-low transmission loss circuit board material (Product No. Laminate R-G545L/R-G545E, Prepreg R-G540L/R-G540E) that is suitable for use in semiconductor packages and modules. The company will start mass-producing the material from June 2018. The newly developed material allows the stable operation of semiconductor devices that process enormous data at a high speed.

Due to the expansion of IoT (Internet of Things) network and the launch of the fifth-generation (5G) mobile communications system scheduled to be implemented in 2020. It is expected that the data communication will become further larger in volume and faster.

This circumstance has created a demand for circuit board materials used in semiconductor packages and modules that need to be adapted for high-speed/large-capacity data communication applications. From its original resin design technology, the company has developed the circuit board material with ultra-low transmission loss for semiconductor packages and modules. The material offers the lowest transmission loss among the other materials used in the industry.

For more information, click here.

Share


Suggested Items

ACE’s AccuWrap Simplifies Multiple Sequential Laminations with Blind Vias

05/29/2018 | Andy Shaughnessy
At DesignCon 2018, I spoke with James Hofer, general manager for Accurate Circuit Engineering, a quick-turn fabricator based in Santa Ana, California. James gave me a preview of AccuWrap, a new type of processing technology that lets designers reduce the amount of copper during sequential laminations while still meeting IPC specs, which should be of great interest to RF designers.

Triangle Labs: Covering the Niche Market of Large Boards

05/18/2018 | Patty Goldman, I-Connect007
I recently had the opportunity to speak with John-Michael Gray, president of Triangle Labs. We had quite a discussion on their rather unique capability of building large-format PCBs and multilayers—perhaps the largest PCBs in the world.

The Vast Offerings in Laminate Technologies from TUC

04/10/2018 | Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.



Copyright © 2018 I-Connect007. All rights reserved.