EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- One week left! Register now for the EIPC 50th Anniversary Conference, June 21–22, 2018.

News form Germany

- 26. FED-Konferenz in Bamberg: Design- und Fertigungsprozesse für smarte Elektronik

- SMT Hybrid Packaging 2018 – Solution-oriented Initiator

Electronics Industry News

- Apple to Make 20% Fewer New Model iPhones this Year

- When Factories Have a Choice Between Robots and People, It’s Best to Start with People

- Conductive Inks: Conformal 3D-shaped Coatings, Game-changing Success?

News from the UK

- ACB Workshop at NPL, June 27, 2018

News from the USA

- New Supervisory Board and Executive Board for Viscom AG

Click here for the International Events Diary 2018

Click here to download the complete SpeedNews Issue 13

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Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets

10/17/2018 | Emilie Jolivet, YOLE DÉVELOPPEMENT
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.



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