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On June 27, IMAPS-UK, with the support of the National Physical Laboratory (NPL), will hold a one day workshop/colloquia on the topic of advanced circuit boards. Attendees will learn about specialist substrates, PCB design theory and methods for pushing the envelope with the latest design rules, and much more.
The workshop will cover all aspects of PCBs and other substrates for advanced applications where miniaturisation, shape, current handling, speed, signal integrity and challenging environments are affecting your application.
For more information, click here.
John (Josse) Steinar Johnsen, ELMATICA
Knowledge and experience are the two key elements when planning a PCB. Today’s PCB designers must have far more knowledge and understanding of the PCB production process than in the past. This is especially important when they plan and how they plan the stackup, via span, routing and power distribution.
Happy Holden, I-Connect007
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).
Real Time with...IPC
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.