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On June 27, IMAPS-UK, with the support of the National Physical Laboratory (NPL), will hold a one day workshop/colloquia on the topic of advanced circuit boards. Attendees will learn about specialist substrates, PCB design theory and methods for pushing the envelope with the latest design rules, and much more.
The workshop will cover all aspects of PCBs and other substrates for advanced applications where miniaturisation, shape, current handling, speed, signal integrity and challenging environments are affecting your application.
For more information, click here.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Sven Kramer, Lackwerke Peters
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.