IPC's PCB Trends Study Underway, OEM Survey Open Until July 6


Reading time ( words)

IPC launched a global survey of original equipment manufacturers (OEMs) in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for OEM survey responses is July 6.

The OEM survey covers technical requirements that support the development of products using the Internet of Things, artificial intelligence, sensor inputs and neural networks, and key technical issues including frequency and reliability. Technical requirements for PCBs are covered, including such properties as thickness, layers, line width and spaces, aspect ratios, I/O pitch, thermal properties, materials and finishes.

Respondents may answer the questions that relate to their type of operations, focusing on one specific end-use application such as automotive, communications, computers, consumer, defense and aerospace, industrial, or medical and instrumentation. OEM participation is crucial to the success of this project, which will provide valuable guidance to the electronics supply chain to meet the current and future needs of OEMs.

A global survey of PCB fabricators will also be launched later this month to collect data from PCB fabricators on their current technical capabilities and the potential for expanded capabilities over the next five years. Together the data on OEM specifications and PCB capabilities will produce detailed aggregate data on the current and future state of circuit board technology and OEMs’ technical requirements, and the outlook for future technology developments through 2023.

Share


Suggested Items

Increasing Productivity for Flex Fabricators

11/14/2018 | I-Connect007 Editorial Team
Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.

Substrates for Advanced PCB Technologies: What Will the Future Hold?

11/06/2018 | Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

08/28/2018 | Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.



Copyright © 2018 I-Connect007. All rights reserved.