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IPC has extended the deadline for the submission of abstract for the technical conference at IPC APEX EXPO 2019 to June 29, 2018.
Presenting at IPC APEX EXPO provides visibility for you and your organization. Thousands of individuals receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry.
Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid-Enthone, Northrop Grumman, Oracle and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO.
Submissions are sought on design, materials, assembly, processes and equipment in areas from advanced technology to underfills and via plugging.
For more information on topics, speaker benefits and speaker recognition awards, please click here.