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IPC has extended the deadline for the submission of abstract for the technical conference at IPC APEX EXPO 2019 to June 29, 2018.
Presenting at IPC APEX EXPO provides visibility for you and your organization. Thousands of individuals receive the technical proceedings from this event, ensuring that your material will be seen by key managers and executives from all segments of the worldwide electronics industry.
Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid-Enthone, Northrop Grumman, Oracle and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO.
Submissions are sought on design, materials, assembly, processes and equipment in areas from advanced technology to underfills and via plugging.
For more information on topics, speaker benefits and speaker recognition awards, please click here.
Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Patty Goldman, I-Connect007
I-Connect007's Patty Goldman has known DIVSYS’ Stan Bentley for many years, having met when the company was called Diversified Systems and they made circuit boards and finished products at their facility in Indianapolis. They saw each other at IMPACT recently, and of course had to have a chat.