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With all the elements that can now affect the solder mask—finer featres, higher temperature solders, final finishes, direct imaging, inkjet—it’s high time to give this final fabrication process a little more attention.
In this July 2018 edition of PCB007 Magazine, our contributors explain how and why solder mask must do its job well—precisely, in fact.
Check it all out this month in PCB007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the pdf copy for future reference.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.
Stephen Las Marias, I-Connect007
In an interview with I-Connect007, Jimmy Fang, VP of business development at Sunshine Global PCB Group, speaks about the key demand drivers for the PCB industry, the challenges in the market, and the opportunities they are seeing.