Reading time ( words)
With all the elements that can now affect the solder mask—finer featres, higher temperature solders, final finishes, direct imaging, inkjet—it’s high time to give this final fabrication process a little more attention.
In this July 2018 edition of PCB007 Magazine, our contributors explain how and why solder mask must do its job well—precisely, in fact.
Check it all out this month in PCB007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
Be sure to download the pdf copy for future reference.
Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Sven Kramer, Lackwerke Peters
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.
I-Connect007 Editorial Team
In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.