EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Proceedings for 50th Anniversary Conference Dusseldorf Available for EIPC Members

- Review Day 1, Part 2 EIPC 50th Anniversary Conference June 21–22, 2018

News from Austria

- Results of the 24th AT&S Annual General Meeting

News from Germany

- Schweizer Electronic AG

Electronics Industry News

- E-Waste Offers Economic Opportunity as Well as Toxicity

News from the UK

- New Sales Director for UK at Ventec International Group

News from WECC Members

Click here for the International Events Diary 2018 

Click here to download the complete SpeedNews Issue 15

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Suggested Items

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing

03/13/2018 | Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.

In Terms of Experience, a 10,000-foot View of China

01/17/2018 | Barry Matties, I-Connect007
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.



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