MacDermid Enthone to Present at Advances in Thermal Management Conference


Reading time ( words)

MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will present at the Advances in Thermal Management Conference which will take place at the Hyatt Regency Denver Tech Center, Denver, Colorado August 8-9, 2018. The conference gathers organizations in the electronics industry supply chain that depend on the precise dissipation of heat in electronic devices.

The presentation, “Understanding Thermal Demands for PCB Design and Developments in Fabrication," will be delivered by Rich Bellemare, Global Applications Manager, Metallization, on Thursday, August 9 at 10 am.

Lenora Clark, Director of OEM Applications, who co-authored the paper with Bellemare and Bill Bowerman, Director of Metallization, said, “New functional demands in the automotive industry are forcing change in the design and fabrication of PCB’s. These changes affect electrical performance and heat management. This paper explains how a unique electroplating method can increase the PCB’s ability to manage heat and increase the life of the product.“

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.

Share

Print


Suggested Items

Better to Light a Candle: Chapter One—Prepping the Next Generation

01/08/2019 | Marc Carter, Independent Contributor
There has been a considerable amount of (electronic) ink and words shared in our industry bemoaning the graying-out of our industry and the growing shortage of skilled people at all levels. (See the May 2017 PCB007 Magazine column “Help Wanted—and How!” for just one example). As is usually the case, though, when all is said and done, more has been said than done.

MacDermid Enthone Discusses Consolidation Benefits

01/08/2019 | Pete Starkey, I-Connect007
At the 2018 electronica exhibition in Munich, Frando van der Pas, director of marketing and sales for MacDermid Enthone—Europe, and Technical Editor Pete Starkey discussed the consolidation benefits and the vision and future of the company.

The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics

12/27/2018 | Corné Rentrop, HOLST CENTRE
The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).



Copyright © 2019 I-Connect007. All rights reserved.