Ichia Swings to Profit in Q2 2018


Reading time ( words)

Taiwan-based Ichia Technologies, which manufactures flexible PCBs as well as mechanical integrated components, has reported pre-tax profits of NT$97 million ($3.2 billion) for the second quarter of 2018 following five straight quarters of losses, according to Digitimes. However, the company generated pre-tax losses of NT$26 million in the first half of 2018.

Ichia saw its June revenues fall 10% sequentially to NT$573 million due mainly to a temporary shutdown of part of its production lines in Suzhou, China, where the Suzhou Environmental Protection Bureau has launched a probe into Ichia’s local plant following accusations that it discharged polluted wastewater, and ordered it improve its wastewater processing as soon as possible. The probe, which took place between May 23 and June 27, has prompted Ichia to suspend part of its etching and copper plating production lines.

Digitimes quoted Ichia CEO Larry Sun as saying that the incident, which already affected Ichia's June revenues, will continue to impact the company's revenues in July. The Suzhou plant is expected to return to full capacity later in July.

Share


Suggested Items

Study on Application of Four-Wire and Four-Terminal Flying Probe Test Scheme

08/10/2018 | Jin Erbing, Joint Stars Technology Co., Ltd
With the four-wire and four-terminal flying probe test method, voids in the holes formed in the PCB due to process differences, thin copper, and poor conduction due to residual adhesive after laser drilling of the HDI board can be detected, and the circuit board guide can be solved. With the development of multilayer, high-density PCB layout, four-wire four-terminal flying probe testing will play an increasingly important role.

Characteristics of New Electroless Au/Pd/Au Process for Fine-Line Applications

07/30/2018 | Tetsuya Sasamura, Ph.D., Tatsushi Someya, et al.
The characteristics of electroless gold/palladium/gold (IGEPIG) deposit, which has been newly developed for fine-line application as electroless nickel-phosphorus (EN) free, has been compared with that of conventional electroless Ni-P/Pd/Au (ENEPIG) deposit and electroless Pd/Au (EPIG) deposit.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1

07/09/2018 | Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.



Copyright © 2018 I-Connect007. All rights reserved.